Samsung, have recently announced they have gone into mass production of the industry’s very first ePoP memory for smartphones. ePoP stands for embedded package on package. The memory module which is a single memory package, has 3GB LPDDR3 DRAM, a 32GB eMMC (Embedded Multi-Media Card) as well as a controller.
The newly designed component is going be used in high-end smartphones. The major selling point of this piece of DRAM hardware is that since it combines all the essential memory components into a single package, it does not take up much space.
The 3GB LPDDR3 mobile DRAM in this element operates at an I/O data transfer rate of 1,866Mb/s and offers 64-bit I/O bandwidth. This is more than capable of satisfying the current market requirements, all the while maintaining efficiency in power, and of course the ultra slim design. It has been said that the space which will be saved could possibly go towards integrating a larger sized battery.